Abstract
This paper focuses on novel modeling of radiated electromagnetic compatibility (EMC) coupling onto the multilayer printed circuit board (PCB). Kron's method integrates the electromagnetic (EM) emission, Taylor's, and field-to-interconnect coupling models. The equivalent graph of the field-to-interconnect coupling is established. The modeling methodology consists in defining the primitive sub-network elements (vias, interconnect lines, pads, and ground plane). Kron's graph equivalent to the EMC problem is elaborated. Finally, the coupling voltages are calculated via the tensorial equation translated from the graph. The radiated EMC Kron's model is validated with a four-layer PCB from 0.4 to 1.4 GHz by two scenarios of EM radiation. As proof-of-concept, a prototype of four-layer PCB was designed, fabricated, tested, and simulated in full wave with a commercial three-dimensional EM tool. For the first case, the multilayer PCB was illuminated by plane wave emission propagating in different directions. The numerical computation from Kron's formalism was compared with simulation and measurement. The other case is the field-to-interconnect coupling between a microstrip I-line PCB, as an EM field emitter, and the multilayer PCB, as a receiver, in 1-m distance. For both cases, the simulated and calculated voltage couplings onto the multilayer PCB are in good agreement.
Published Version
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