Quilt Packaging: High-Density, High-Speed Interchip Communications

Abstract

ldquoQuilt packagingrdquo (QP), a new superconnect paradigm for interchip communication, is presented. QP uses conducting nodules that protrude from the vertical facets of integrated circuits to effect a dense, fast, and reduced-power method of interfacing multiple die together within a package or on a multichip module. The concept of QP is presented along with a discussion of advantages over traditional system-on-chip and other system-in-package technologies. A process flow and results of chip fabrication are detailed. Simulations show expected signal propagation between adjacent die of greater than 200 GHz, and measurements of interconnected chips confirming low losses and resonance-free operation to at least 40 GHz have been achieved.