Abstract
Quilt packaging, (QP) a new paradigm for interchip communication, is presented. QP uses conducting modules that protrude from the sides of integrated circuits to affect an enhanced-speed, reduced-power method of interfacing multiple die together within a package or on a multichip module. The concept of QP is introduced along with a discussion of advantages over traditional system-on-chip and system-in-package technologies. Details of a process flow and preliminary results are presented. Simulations show expected signal propagation between adjacent die of greater than 150 GHz
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
