Abstract
This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.
Highlights
Conventional quartz resonator components are packaged in metal lid with ceramic-based interposer enclosures
In order to keep frequency components from moisture or other contamination and mechanical attack, quartz resonator requires specialized packaging with the protective cap over the quartz resonator blank [1,2]. With these technologies of metal lid and ceramic substrate, current quartz resonator can be fabricated in a size of 1.6 × 1.2 mm
Thermal stress issues Considering the thermal reliability of the integration of quartz resonator and this designed interposer, thermal process is implemented to inspect the quality of quartz resonator with through-silicon via (TSV) interposer
Summary
Conventional quartz resonator components are packaged in metal lid with ceramic-based interposer enclosures. In order to keep frequency components from moisture or other contamination and mechanical attack, quartz resonator requires specialized packaging with the protective cap over the quartz resonator blank [1,2] With these technologies of metal lid and ceramic substrate, current quartz resonator can be fabricated in a size of 1.6 × 1.2 mm. Challenges and issues of current manufacturing of ceramic-based quartz resonator package, including high-cost packaging material of metal lid, one chip sealing bonding, and scaling limit of ceramic substrate, make the shrinkage of quartz resonator packages difficult For this reason, to develop a new packaging method with quartz resonator is necessary to solve the abovementioned difficulties and achieve a high performance, small form factor, and low manufacturing cost [3,4]. Multi-chips integration is the trend of the present semiconductor and package industries
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