Prospects for automotive SiP modules applying IC assembly and packaging technology

Abstract

Abstract We develop a package that ensures quality complying with AEC-Q 100 Grade 2 which is in-vehicle quality from various flip chip mounting methods and bump sealing technology with underfill resin and mold resin. FC CSP with heat spreader mounted on the product which has started mass production since last year is in the lineup, The heat dissipation can be improved by attaching the heat spreader directly to the chip backside which are heat sources and the Thermal Interface Material (TIM), using our assembly technology of flip chip mounting and molding the periphery while exposing the chip backside. By adjusting the Coefficient of Thermal Expansion (CTE) and thickness of the material, we realize low warpage and low coplanarity at reflow temperature and product use temperature environment and reduce package displacement behavior, we will improve the secondary mountability to the motherboard and provide reliable packages. Furthermore, it can be applied to SiP modules. It is also possible to construct multiple chip modules by mounting multiple ICs or placing low-passive components around them. We will consider heat spreader mounting on multiple ICs that generate heat, and metal coating on the entire SiP module to have a structure that achieves both heat dissipation and electromagnetic shielding as a future idea.