Abstract
Abstract Work is described in which chromium-doped semi-insulating gallium arsenide has been successfully doped n-type with ion implanted silicon and sulfur, and p-type with ion implanted carbon. A dilute chemical etch has been employed in conjunction with differential Hall effect measurements to obtain accurate profiles of carrier concentration and mobility vs. depth in conductive implanted layers. This method has so far been applied to silicon-and sulfur-implanted layers in both Cr-doped semi-insulating GaAs and high purity vapor grown GaAs. In the case of sulfur implants, a strong diffusion enhancement has been observed during the annealing, presumably due to fast-diffusing, implantation-produced damage. Peak doping levels so far obtained are about 8 × 1017 electrons/cm3 for silicon implants and 2 × 1017 electrons/cm3 for sulfur implants. Mobility recovery has been observed to be complete except in regions near the surface which are heavily damaged by the implantation.
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