Properties of dislocation networks formed by Si wafer direct bonding

Abstract

Reproducible formation of well-controlled dislocation structures is a prerequisite to use dislocations as an active part of devices. Regular dislocation networks have been formed at the interface by Si wafer direct bonding. The barriers of interface were generally smaller than 100 meV. The temperature dependence of the electron-beam-induced current (EBIC) contrast of the interface indicates a deep state density of a few 10E5 per cm along the dislocation lines in the network. It is also found that the dislocation networks in Si can act as effective channel for carrier transport. Photoluminescence (PL) reveals that the D line spectrum related to the dislocation networks can be tailored by the bonding misorientation. So, the D1 line can be made the dominating feature in the PL spectrum. It is suggested that regular dislocation networks represent an interesting new nanosystem for future applications, such as accommodation biomolecules onto silicon, dislocation-based LED or buried nanowires.