Abstract
Power electronics are evolving to meet the high demands of new and emerging applications such as e-mobility/vehicle electrification. Pressure sintered silver is fast becoming the material of choice for die attach due the favorable material properties and proven reliability. This paper will introduce a copper sinter paste that can achieve consistently high shear strengths ~40MPa when sintered with 15-20MPa of pressure. The impact of process conditions is examined, plus reliability testing. Aging tests at 250ᵒC for more than 1000 hours show an increase in shear strength compared to time zero. TCT of -40ᵒC to 175ᵒC was done for >3000 cycles, no delamination was observed and again the shear strength was shown to increase through TCT. Microstructure analysis of the sinter layer is compared at time zero and after 1000 and 2000 cycles of TCT.
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