Abstract
AbstractIt has been observed that the sheet resistance of a Ti-salicided polysilicon-gate electrode or source/drain region increases significantly as the dimension reaches the lower sub-micron range. The resistance of platinum and nickel silicide (PtSi and NiSi), however, does not increase with reduced linewidth. We have studied PtSi and NiSi films with deep sub-micron linewidths on single crystal or poly-Si substrates. In this study, the material properties such as sheet resistance, grain structure and surface morphology of these silicide films in confined geometries are reviewed and compared with TiSi2. Process windows for forming and maintaining these silicides are explored.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
