Abstract

In this paper, results obtained on nickel silicidation and nickel−platinum silicidation in a RTA system based on conductive heating are presented. It is shown that with the Levitor system, it is possible to obtain silicide uniformities <1% at temperatures as low as 240 °C. Next to these, within-wafer results, run-to-run uniformity results are presented. The run-to-run results, monitored over 18 weeks, show that with the Levitor system the temperature repeatability is within a band of 1.5 °C. It can be concluded that with the Levitor system excellent within-wafer and run-to-run, uniformities can be obtained at temperatures well within the process window for nickel silicidation.

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