Abstract
PET/Cu composite foils are expected to have widespread applications due to their lightweight, good bendability and excellent electrical conductivity. However, efficiently and stably preparing copper cladding layers on the surface of PET film with good bonding to the substrate remains a challenge. In this study, by optimizing the process route and adopting a synergistic method involving electroless plating and electroplating, PET/Cu composite foils with excellent conductivity and robust bonding can be successfully prepared. The experimental results indicate that the optimal performance of PET/Cu composite foils is achieved when the PET substrate is roughened with KMnO4/H+ solution, activated with salt-based colloidal palladium, subsequently treated with a weak alkaline electroless nickel plating solution for 5 min, and plated copper at a current density of 0.4 A·dm−2. The adhesion strength of the PET/Cu composite foils meets the ASTM 5B standard and the electrical conductivity reaches up to 4.17 × 107 S/m. The method proposed in this study offers an efficient and concise approach for preparing high-quality PET/Cu composite foils that hold great potential for diverse applications in flexible copper clad laminates.
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