Design of flexible copper clad laminate with outstanding adhesion strength induced by chemical bonding

Abstract

The preparation method of two-layer flexible copper clad laminate (FCCL) including coating method, sputtering method, and electrochemical plating method has many disadvantages such as complex production process and large investment. In this paper, the two-layer FCCL based on polyarylene ether nitriles terminated with phthalonitrile (PEN-t-Ph)/glass fabric (GF) composite was prepared by a simple laminating method without the adhesive. The morphology of the PEN-t-Ph/GF composite was investigated, and the morphology, electrical properties, and adhesion strength of the FCCL were also investigated in detail. In the presence of copper ions, the copper phthalocyanine will be formed, so that the copper clad adheres to PEN-t-Ph/GF composite tightly, which can be confirmed by FTIR, SEM, EDS, and XPS. Moreover, The FCCL possesses excellent thermal property with glass transition temperature (Tg) of 187.50 °C, good electrical properties with dielectric constant of about 4.5 and dielectric loss of about 0.008 at 200 kHz as well as outstanding adhesion strength with shear strength of 71.23 MPa and peel strength of 1.52 N/cm.