Abstract
In this study, the effect of two laminating parameters, laminating pressure and holding time, on the adhesion strength of flexible copper clad laminate (FCCL) with an epoxy-type adhesive layer was evaluated. The changes in the adhesion property, fracture surface, morphology, and chemical bonding state were characterized by 90° peel test, scanning electron microscopy (SEM), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The results showed that the adhesion strength of the FCCL was decreased as the laminating pressure was increased beyond the suitable level. Laminating pressure exerted the greatest influence over the FCCL adhesion strength. On the other hand, the holding time did not significantly affect the peel strength of the FCCL. The fracture of FCCL occurred at the interface between the rolled Cu and the adhesive layer. In addition, the FCCL with high adhesion strength was stable with the variation of adhesion strength after temperature and humidity test.
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