Abstract
Due to the growing needs of thermal management in modern electronics, epoxy-based composites are increasingly demanded in heat dissipating materials. A simple preparation of composites with high thermalconductivity was developed through the graphenenanosheetshomogeneously dispersed in theepoxy matrix. A high thermal conductivityof 0.4843W/mK ( increased by184% over that of pure epoxy) could be obtained for the compositeswith a filler content of 5wt.%. It was proved that high aspect ratio of GNPs are critical issues of theconstitution of a special interface region between the GNPs and epoxy matrix of the composites.The more than mere additive effect on the through-thickness thermal conductivity suggests synergistic physical interactions between graphenenano sheets leading to further enhancement in the through-thickness thermal conductivity. Thus, the graphene-reinforced composites are promising for usageas an efficient heat spreader for heat dissipation applications.
Published Version
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