Electroless deposition surface engineering of boron nitride sheets for enhanced thermal conductivity and decreased interfacial thermal resistance of epoxy composites

Abstract

Filler surface engineering has become an effective method to improve the thermal conduction performance of polymeric composites. However, most of the surface engineering deposits low thermal conductivity materials on the surface of fillers. The increased interfacial thermal resistance between the functional filler will deteriorate the heat transfer capability of thermal conduction network. In order to construct an excellent thermal conduction network, the electroless deposition surface engineering was successfully designed to decorate the surface of BN sheet with high thermal conductivity metallic copper nanoparticles. Through the full characterization of the BN@CuNP and its epoxy-based composites, the effects of electroless deposition surface engineering on thermal conduction enhancement were investigated. The copper nanoparticles deposited on the surface of BN sheets will make the BN@CuNP fillers possess high thermal conductivity and effectively bridge the BN sheets, thereby exhibiting a synergistic effect in reducing the interfacial thermal resistance and enhancing the heat transfer capability of the BN@CuNP thermal conduction network. With the increase of filler content, the effects of electroless deposition surface engineering on thermal conduction enhancement are continuously promoted. The electroless deposition surface engineering shows great advantages in high thermal conductive composites design and fabrication.