Preparation and Properties of Epoxy Adhesives with Fast Curing at Room Temperature and Low-Temperature Resistance.

Abstract

Developing a highly efficient multifunctional epoxy adhesive is still an enormous challenge, which can rapidly cure at room temperature and has excellent low-temperature resistance performance and is crucial for the epoxy adhesive and electrical sealing fields during severe cold seasons. Herein, diglycidyl phthalate (DP) was synthesized with phthalic anhydride (PA) and epichlorohydrin (ECH) to enhance the curing rate and low-temperature resistance of bisphenol A diglycidyl ether (DGEBA) adhesive. The modified DP/DGEBA adhesives were systematically analyzed by gel time, mechanical properties, and aging resistance (time, temperature, and dry/wet treatment). The results showed that DP with highly active ester groups significantly accelerates the curing speed of DP/DGEBA. DP's rigid aromatic ring-benzene ring and flexible group-ester group gave the adhesive better low-temperature resistance. When the addition of DP was 10 wt % (based on the mass of DGEBA), the gel time of DP/DGEBA epoxy adhesives was reduced by 58 min compared to unmodified DGEBA epoxy adhesive, and after aging at low temperature (-20 °C) for 7 days, the tensile shear strengths of polyvinyl chloride (PVC) and aluminum plate increased by 76.2 and 80.6%, respectively. The results of non-isothermal curing kinetics and dynamic mechanical analysis suggested that when the amount of DP was 10 wt %, the reaction activation energy of DP/DGEBA epoxy adhesive decreased by 4.0%, and the cross-linking density increased by 8.9%. Moreover, the toughness of the modified adhesive was also improved. This study opens up a feasible way for the development of a low temperature-resistant epoxy adhesive cured rapidly at room temperature in practical application.