Abstract

Epoxy adhesives form very strong and durable bonds with most materials and are widely used in various structural bonding applications. Epoxy adhesives are formulated in the form of a compound containing epoxy resin and curing agent, catalyst with modifiers and additives. Typical epoxy resins include glycidyl ether epoxy resins such as Bisphenol A, Bisphenol F and novolac type, and glycidyl amine epoxy resin, glycidyl ester epoxy resin as well as cycloaliphatic epoxy resin. Epoxy adhesives are supplied in both one-component and two-component packages depending on curing agent used and curing method applied. Two-component epoxy adhesives are prepared by packaging epoxy composition and curing agent composition separately. Almost all room temperature cure epoxy adhesives are supplied in two-component packages. One-component epoxy adhesives are prepared and supplied by mixing all formulated components in advance including epoxy resin and curing agent. One-component epoxy adhesives usually need cure at elevated temperature and storage at low temperature conditions. Typical room temperature cure epoxy adhesives, thermal cure epoxy adhesives and UV cure epoxy adhesives are described. Toughened high performance epoxy adhesives, low temperature cure one-component epoxy adhesives, instant bonding epoxy adhesives and sustainable epoxy adhesives are recent progressions and new trend in epoxy adhesive technology developments.

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