Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni

Abstract

Ni3Sn4 grains were formed on Ni by reactive wetting between molten eutectic SnPb and thermally annealed Ni foil. Using synchrotron white beam micro x-ray diffraction analysis, two kinds of preferred orientation relationships between Ni3Sn4 and Ni were found. The existence of preferred orientation with large interfacial misfit is suggested as a general mechanism of intermetallic compound formation in reactive solder wetting on metals.