Prediction methodology of single event effect sensitivity and application on SRAM device

Abstract

This work reports a contribution to the evaluation of Single Event Effect (SEE) sensitivity. This prediction should allow designers to assess radiation sensitivity of Application Specific Integrated Circuit (ASIC) during the design stage in order to harden it efficiently. Such tools already exist but not a complete method starting from the whole IC design up to the SEE reliability prediction. A detailed study of these tools allows the identification of the methods already used to evaluate the failure risk corresponding to specific types of SEE. A comparative study will allow the determination of their relevance. The implementation of the most suitable tool suite in an engineering software is a long and complex process. To demonstrate its feasibility, a list of selected models was made to build a simple method. It was used to perform an SEE simulation on a realistic model of SRAM device.