Abstract

Precipitation behaviors of Cu and Fe on Frank-type partial dislocations bounding bulk stacking faults in Czochralski-grown silicon are investigated by means of the electron beam-induced-current (EBIC) technique and transmission electron microscopy (TEM). Frank partials in a Cu-contaminated specimen do not exhibit an EBIC contrast at room temperature when the specimen is cooled slowly; however, in the Fe-contaminated specimen, they exhibit EBIC contrast at room temperature due to their Fe contamination. The TEM micrograph shows that Cu develops precipitate colonies in the region away from stacking faults and does not precipitate on Frank partials in the specimen. The results indicate that Fe impurity decorates Frank partials more easily than Cu impurity in Si.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.