Abstract
In this paper, an effect of junction temperature swings (ΔTj) on reliability of IGBT modules is studied with 600 V, 30 A, transfer molded power modules. This study is based on power cycling test results of 18 IGBT modules under three different junction temperature swings, namely 40 °C, 60 °C and 70 °C, by means of an advanced power cycler. The advanced power cycler allows performing power cycling tests under similar conditions of IGBT modules in power electronics applications. This paper presents post-failure analysis of the tested IGBT modules of interest in order to investigate the failure mechanism and also to compare results under different Tj. Further, a lifetime factor in respect to ΔTj is modeled with different lifetime definitions and confidence levels. This paper enables a better understanding of the junction temperature swing-related failure mechanisms and reliability performance of transfer molded IGBT modules for power electronics applications.
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