Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module

Abstract

In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT modules under various mission profiles of converters. The power cycling tests are performed by an advanced power cycling test setup which enables tested modules to be operated under more realistic electrical conditions during the power cycling test. The analysis of the test results and the temperature swing duration dependent lifetime factor under different definitions and confidence levels are presented.