Potential Stable Low-Permeation Rate Standard Based on Micro-machined Silicon.

Abstract

Silicon wafers with micro-machined holes were evaluated for use as low-permeation-rate standard artifacts. Accuracy, stability, and reliability were assessed. Two independent experimental techniques for evaluating permeation were used: chilled mirror hygrometer and mass loss. The wafers exhibited a well-defined linear relationship between hole area and resultant water partial pressure for both techniques, although the mass loss curve exhibited a constant vertical offset from the hygrometer curve, attributed to water loss through the O-ring seal. In contrast to polymer permeation standards, Si wafers provided long-term reproducible permeation rates. However, they were also highly fragile, with most of them cracking during the course of the investigation.