Abstract
Package-on-Package (PoP) technology has been in production for commercial and portable electronic applications for many years. The key challenge for PoP in automotive applications is meeting the aggressive defect level requirements. The need for PoP has historically been driven by mobile and tablet applications and an increased demand for more processor and memory performance within smaller spaces. With the maturity and excellent historical performance of PoP technology used with TI OMAPTM processor products, PoP can now be introduced as a reliable packaging technology in the automotive industry. This paper will describe the work involved in the enablement of commercial PoP technology into the automotive industry. The challenges and requirements regarding package design, warpage performance, surface mount (SMT) characterization, and board-level reliability (BLR) performance will all be explained.
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