Plasma‐Enhanced Atomic Layer Deposition of Palladium on a Polymer Substrate

Abstract

AbstractIn this paper, a method for the plasma‐enhanced (PE) atomic layer deposition (ALD) of palladium on air‐exposed, annealed poly(p‐xylylene) (Parylene‐N, or PPX) is presented. Palladium is successfully deposited on PPX at 80 °C using a remote, inductively coupled, hydrogen/nitrogen plasma with palladium (II) hexafluoroacetylacetonate (PdII(hfac)2) as the precursor. By optimizing the mixture of hydrogen and nitrogen, the polymer surface is modified to introduce active sites allowing the chemisorption of the PdII(hfac)2. In addition, enough free hydrogen atoms are available at the surface for ligand removal and Pd reduction, while at the same time, enough hydrogen atoms are consumed in the plasma to ensure there is no visible degradation of the PPX. X‐ray photoelectron spectroscopy (XPS) measurements of the substrate after hydrogen/nitrogen plasma treatment at 50 W clearly show the presence of nitrogen bound to the substrate surface. XPS measurements of the deposited Pd films indicate good quality for both substrates, suggesting that the substrate temperature was low enough to prevent dissociation of the hfac ligand and adequate scavenging of the hfac ligand by the available atomic hydrogen. The remote hydrogen/nitrogen plasma enables Pd film deposition on polymer surfaces, which do not typically react with the Pd precursor, and are not catalysts for the dissociation of molecular hydrogen.