Abstract
Phosphinated polyimide (p-PI) with specific amounts of phosphinate diamine has shown improved adhesion strength after hot-pressing to flexible copper clad laminates (FCCL) in previous work. By coupling p-PI with amino-functionalized polydimethylsiloxane (a-PDMS), the adhesion properties of the poly(imide-siloxane) hybrid films (p-PI-Si-w%) were further enhanced. Meanwhile, sufficient mechanical strength and optical transparency of the hybrid films were maintained. The XPS depth profile confirmed the presence of SiC and SiO groups on the surface and consequently increased the surface roughness of p-PI-Si-w% films. Therefore, the peel strength of p-PI-Si-w% significantly increased with a-PDMS content. The low dielectric p-PI-Si-8% film exhibited a peel strength of 0.95 kg/cm and showed a balanced melt-flow condition, which makes it a potential candidate for FCCL processing.
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