Abstract
Interfacial phase-change memory (iPCM), comprising alternating layers of two chalcogenide-based phase-change materials—Sb2Te3 (ST) and GeTe (GT)—has demonstrated outstanding performance in resistive memories. However, its comprehensive understanding is controversial. Herein, the phase-change characteristic of iPCM is identified using atomic scale imaging, X-ray diffraction, and chemical analysis with first-principles density functional theory (DFT) calculations. By inducing laser pulsing, the ST/GT superlattice structure in the low-resistance state tends to reversibly convert into the modified metastable face-centered cubic (fcc) GeSbTe structure in the high-resistance state. This transition is driven by Ge atom rearrangement to pre-existing vacancy layers and ordered vacancy-layer formation. DFT atomistic modeling shows that the resistance difference of 102 orders between low- and high-resistance states is a direct consequence of the intercalation of Ge atoms into the vacancy layer. These results provide insights into iPCM phase-change mechanisms and phase-change random access memory design with low energy and high speed.
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