Performance Comparision of Mixed CNT Bundle in Global VLSI Interconnect

Abstract

This paper proposes a new modeling approach for mixed carbon nano tube (CNT) bundle (MCB) interconnects. An accurate modeling hierarchy has been proposed for MCB structures. Bundled single-walled CNTs (SWNTs) and multi-walled CNTs (MWNTs) have been modeled as equivalent single conductor (ESC) transmission lines and then combined to form a MCB interconnect. This MCB interconnect is basically a multiple single conductor model. By considering different arrangements of SWNT and MWNT in mixed CNT bundle, performance is analyzed for two different MCB structures (structure1 and structure 2) in terms of propagation delay, cross talk delay and power dissipation. It has been observed that cross talk delay for structure 1 is 55.5% lesser as compared to structure 2. Consequently, power dissipation for structure 1 is also lesser with respect to structure 2.