Abstract
Patterned micropads made of metallic nanowires,50 µm in diameter, are fabricated on a silicon substrate. An aluminium film patterned withSiO2 is anodized to fabricate a patterned nanoporous alumina (PNA)template in which metallic nanowires are electrodeposited.SiO2 that is deposited using the plasma-enhanced chemical vapour deposition process isdemonstrated to be an effective barrier to anodization for the fabrication of highaspect ratio PNA templates. Current–voltage characteristics of an individualcopper nanowire micropad display ohmic behaviour with a low resistance value of5.5 mΩ. Thenanowires are able to withstand the solder reflow process. Cu nanowire/Sn solder reflow reaction leadsto Cu6Sn5 intermetallic formation. These micropads made of metallic nanowires have the potentialfor application as chip to substrate interconnects. Nanostructure synthesis iscarried out using standard microelectronics fabrication techniques that wouldenable easy integration of such nanodevices into routine silicon manufacturing.
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