Parametric Study in Thermal Optimization Design of Multi-Chip Module

Abstract

A three dimensional model of Multichip Module (MCM) is built with ANSYS. The temperature and thermal stress field distribution are studied. Taking into account the global heat dissipation and the local thermal stress, the effect of structure parameters and material properties on the maximum chip junction temperature and the maximum thermal stress of MCM are studied. The four design parameters are the thickness of the substrate, thermal conductivity of the substrate, thermal conductivity of the thermal grease and convection heat transfer coefficient. This paper gave the method to reduce the temperature, and the results provided an efficient basis for the compromising design of thermal stress, which is benefit for the thermal optimization of MCM.