Thermal Stress Failures in Electronics and Photonics: Physics, Modeling, Prevention

Abstract

Reliability physics underlying thermal stress failures in electronic, optoelectronic and photonic structures is discussed, with an emphasis on the roles of predictive modeling and failure-oriented-accelerated testing (FOAT). The following major topics are addressed: 1) Bi-material and die-substrate assemblies; 2) Analytical modeling vs. finite-element analysis (FEA); 3) Thermal stress failures in solder joints; 4) Global and local thermal mismatch stresses; 4) Thermal stress in assemblies bonded at the ends; 5) Thermal stress relief in assemblies with low modulus adhesives at the ends; 6) Design recommendations for reducing thermal stresses; 7) Thermally matched assemblies; 8) Thermal stress in thin films; 9) Thermal stress in plastic packages of IC devices; 10) Bow-free assemblies; 11) Probabilistic approach; 12) Thermal stress in optical fibers; 13) Thermal stress in nano-systems. It is concluded that physically meaningful and easy-to-use modeling, and especially analytical modeling, is an important tool for the prediction and prevention of thermal stress falues and electronics, opto-electronics and photonics systems.