Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad Packages

Abstract

Abstract Polymers being used in a plastic-encapsulated integrated circuit (IC) package exposed to a humid environment absorbed moisture and expand resulting to a so called delamination failure. Weak or imperfect adhesions between the interfaces of the mold compound and adhesive unto the leadframe surface are often the main sources of these failures. In response to automotive requirements and to ensure excellent package reliability and integrity, delamination in all interfaces should then be eliminated. Thus the primary objective of this work is to fulfill the no delamination criteria in all interfaces after moisture soak for an exposed pad package. To satisfy these requirements, activities includes leadframe design improvements, surface enhancement and bill-of-material changes. With the design improvements implemented, still the material compatibility plays an important role in achieving improved package reliability.