Package Assembly Design Kits - What are They and How Can They Benefit the Packaging Community — Chiplets and 3D Stacking. An EDA perspective of Heterogenous Integration

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An IC designer wouldn’t dream of starting a new die design without a process design kit (PDK). PDK’s take much of the “can-this-be-built” guess work-out a designing a new die by providing data on materials, libraries and design rules all directly from the semiconductor fab who is going to build the wafer. Over the past few years as packaging technologies evolve, and in many cases start to look more like IC design technologies, the package design community has started talking about the need for package assembly design kits (PADK/ADK). However, there is not a one-to-one mapping of an IC PDK to a package ADK. This presentation outlines and describes what the contents of PADK could and should provide to streamline the design of today’s complex multi-chip(let) packages.