Abstract
Ion beam synthesis of buried CoSi2 layers in Si(100) (Co+ energy=170 keV, dose=1.7×1017 ions cm−2) is studied as a function of implantation temperature (250→500 °C) and beam current density (1.6→3 μA cm−2). Conventional cross-section transmission electron microscopy and Rutherford backscattering spectrometry are used to correlate the experimental conditions with the amount of pinholes in the silicide layer and the flatness of the CoSi2/Si interfaces after annealing. Optimum implantation conditions yielding a pinhole-free buried silicide layer with flat interfaces are obtained.
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