Optimal Design of High-Frequency Induction Heating Apparatus for Wafer Cleaning Equipment Using Superheated Steam

Sang Min Park,Joon Sung Park,Jin-Hong Kim,Jun-Hyuk Choi,Byoung Kuk Lee,Eunsu Jang

doi:10.3390/en13236196

Sang Min Park, Joon Sung Park + Show 4 more

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https://doi.org/10.3390/en13236196

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Abstract

In this study, wafer cleaning equipment was designed and fabricated using the induction heating (IH) method and a short-time superheated steam (SHS) generation process. To prevent problems arising from the presence of particulate matter in the fluid flow region, pure grade 2 titanium (Ti) R50400 was used in the wafer cleaning equipment for heating objects via induction. The Ti load was designed and manufactured with a specific shape, along with the resonant network, to efficiently generate high-temperature steam by increasing the residence time of the fluid in the heating object. The IH performance of various shapes of heating objects made of Ti was analyzed and the results were compared. In addition, the heat capacity required to generate SHS was mathematically calculated and analyzed. The SHS heating performance was verified by conducting experiments using the designed 2.2 kW wafer cleaning equipment. The performance of the proposed pure Ti-based SHS generation system was found to be satisfactory, and SHS with a temperature higher than 200 °C was generated within 10 s using this system.

Highlights

The cleaning process is the most important task in improving the yield and reliability of the manufacturing process
With advancements in the fabrication technology of liquid crystal displays (LCDs), the size of the mother glass (MG) is continually being increased, and the cleaning processes employed during fabrication are becoming increasingly vital
Contaminants such as residual organic materials and particulates are present on the surface of work pieces such as semiconductor wafers and the MG of LCDs [1,2]

Summary

Introduction

The cleaning process is the most important task in improving the yield and reliability of the manufacturing process. With advancements in the fabrication technology of liquid crystal displays (LCDs), the size of the mother glass (MG) is continually being increased, and the cleaning processes employed during fabrication are becoming increasingly vital. Contaminants such as residual organic materials and particulates are present on the surface of work pieces such as semiconductor wafers and the MG of LCDs [1,2]. A dry cleaning method has been developed to compensate for the disadvantages

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