Abstract
A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the skin tissue. Finite element analysis is performed to validate the analytic model through the comparison of temperature distributions in the system. The influences of geometric and loading parameters on the temperature increase under a pulsed power are investigated. It is shown that a small duty cycle can reduce the temperature increase of the system effectively. A thin substrate can reduce the device temperature but increase the skin surface temperature. The results presented may be helpful to optimize the design of flexible electronic devices to reduce the adverse thermal influences in bio-integrated applications.
Highlights
Recent advances in flexible electronics enable the development of epidermal electronics [1,2], which could be mounted onto the skin and retain conformal contact with the skin under compression and tension
Knowledge on heat transfer within skin tissue due to the physical coupling of epidermal electronics to the skin is critical for the use of epidermal electronics since even only a few degrees in temperature increase may induce uncomfortable feelings
Many researchers have performed the thermal analysis of flexible electronic devices by adopting the Fourier heat conduction equation
Summary
Recent advances in flexible electronics enable the development of epidermal electronics [1,2], which could be mounted onto the skin and retain conformal contact with the skin under compression and tension. The top surface of encapsulation layer has the natural convection boundary with h as the coefficient of heat convection. The bottom surface of fat layer has constant core body temperature Ts. The temperature in the device satisfies the Fourier heat conduction equation ki d2 Ti dz2
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