Abstract
A comprehensive review of the application of different ceramics for MEMS devices is presented. Main ceramics materials used for MEMS systems and devices including alumina, zirconia, aluminum Nitride, Silicon Nitride, and LTCC are introduced. Conventional and new methods of fabricating each material are explained based on the literature, along with the advantages of the new approaches, mainly additive manufacturing, i.e., 3D-printing technologies. Various manufacturing processes with relevant sub-techniques are detailed and the ones that are more suitable to have an application for MEMS devices are highlighted with their properties. In the main body of this paper, each material with its application for MEMS is categorized and explained. The majority of works are within three main classifications, including the following: (i) using ceramics as a substrate for MEMS devices to be mounted or fabricated on top of it; (ii) ceramics are a part of the materials used for an MEMS device or a monolithic fabrication of MEMS and ceramics; and finally, (iii) using ceramics as packaging solution for MEMS devices. We elaborate on how ceramics may be superior substitutes over other materials when delicate MEMS-based systems need to be assembled or packaged by a simpler fabrication process as well as their advantages when they need to operate in harsh environments.
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