On-Chip Yagi–Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging

Abstract

In this paper, we propose horizontal wireless signal transmission using on-chip Yagi–Uda antennas, which are used for stacked multi chip packaging (MCP). The features of this study are (a) multiple signal transmissions are realized using directional antennas, (b) measured directivities of on-chip Yagi–Uda antennas are demonstrated, and (c) a scaling scenario of the on-chip directional antenna is presented to achieve the same signal throughput as the clock frequency. The Yagi–Uda antenna offers high directivity and gain; thus, it can provide space-division multiplexing and multiple signal transmissions for intra and inter chip communication.