Numerical thermal analysis and structural optimization of cascaded PCM heat sinks for thermal management of electronics

Abstract

In the present study, an innovative cascaded phase change material (PCM) heat sink using organic PCMs was proposed for electronic thermal management. The design arranges multiple PCMs with progressively lower melting points along the heat transfer path, allowing active control of the melt front. A numerical model with 5 % accuracy was developed to evaluate thermal performance. Based on the validated model, the effects of PCM stage numbers, PCM volume fractions, fin types, and fin volume fractions were analyzed. The fin volume fractions were further optimized using a support vector machine (SVM) and genetic algorithm (GA) methods. Results showed that a three-stage PCM heat sink with pin fins and increasing configurations outperformed single-stage PCM heat sinks, enhancing heat transfer by up to 36.7 %. Additionally, the innovative cascaded PCM heat sink with a uniform 20 % fin volume fraction across the three stages achieved a 38.8 % improvement compared to single-stage configurations. When the fin volume fractions were set to 24.1 %, 17.6 %, and 13.0 % for the three stages, thermal performance of the innovative cascaded PCM heat sink was enhanced by up to 39.8 % compared to single-stage configurations. The findings provide valuable insights for the design and application of PCM-based thermal management systems, potentially leading to more efficient solutions for various engineering fields.