Investigation of enhanced PCM heat sink design under extreme thermal conditions for high-heat-generating electronic devices

Abstract

In this study, a novel enhanced phase change material (PCM) heat sink design is proposed to improve energy efficiency and maintain quiet operation under extreme thermal conditions for high-heat-generating electronic devices. To overcome the thermal conductivity and heat transfer limitations of the PCM heat sinks, fins, metal foams, and nanoparticles were integrated. A simulation model for the PCM heat sink was developed based on experiments. The thermal performances of different PCM heat sinks were comprehensively evaluated and compared through an in-depth analysis of their thermal behaviors. Consequently, at the heat flux of 20 kW·m−2, a proposed nano-enhanced PCM heat sink with fins and metal foams reduces the surface temperature of high-heat-generating electronic devices by 40.0 K during pre-heating process and maintains a minimum temperature of 54.47°C, decreasing the temperature by 41.4 K during melting process compared to the PCM heat sink without thermal conductivity enhancers. Furthermore, the proposed PCM heat sink exhibited the longest critical duration, approximately 26 times longer than that of a PCM heat sink without thermal conductivity enhancers. Additionally, within the critical temperature range, employing a PCM with a suitable melting temperature and metal foam parameters is advantageous for the thermal management of high-heat-generating electronic devices.