Numerical Simulation on the Effect of the Cooling Channel Design on the Warpage of a Thin-Wall Injection Molding Product

Abstract

In this research, the effect of the colling channel design on the warpage of a thin-wall injection molding plastic product has been numerically simulated. Three cooling channel with different designs are considered. The results indicate that the total displacement of warpage on product significantly depends on cooling channel layout. Using a cooling channel with conformal form, the heat accumulation inside the box is released. Therefore, the maximum total displacement dramatically reduces from 1.05 mm in the original design to 0.19 mm. Though increasing conformal cooling channel length will even decrease the maximum displacement to 0.09 mm, the jump of coolant pressure to 86.7 MPa is a big drawback. Therefore, the final suitable design for this system is the short conformal cooling channel.