Abstract
Studies on cuprous chloride (CuCl) sublimation, thin film deposition, and growth on commercially available tin oxide coated glass substrates were performed by adjusting substrate and vapor source thermal parameters. A systematic method for measuring CuCl film thicknesses was implemented using scanning white light interferometry. Furthermore, structural characteristics of the films were evaluated via scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). Thickness measurements at established locations determined the growth rates of CuCl thin films with respect to deposition conditions. SEM and EDS results revealed that localized clusters (islanding) occurred at the initial stages of growth. As growth continued, the islands began to coalesce and develop nonuniform CuCl grain networks across the substrate. The results support the Volmer–Weber growth mode as the primary mechanism responsible for such growth behavior.
Accepted Version
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call