Novel Underfill Material for Wafer Level Packaging

Abstract

Abstract Wafer level packaging presents a paradigm shift in IC packaging manufacturing toward low cost and high performance electronic products. This article reviews different designs of wafer level packages. Wafer level underfill is identified as a convergence of flip‐chip and wafer level chip scale package. Due to the unique curing characteristics of the wafer level underfill, there is a need for a fundamental understanding of the underfill curing process. In this study, we have explored two underfill formulations and investigated their curing properties and the gelation behavior. A successful wafer level underfill formulation was developed and characterized. The assembly of the wafer level package was demonstrated.