Abstract
WLCSP (wafer level chip scale package) has been developed for several years to reduce package size, process cost and to increase product reliability. With the development of high-density, flip chip packages, an underfill process for fine-pitch bump size become more important. WLUF (wafer level underfill) is a technology that applies an underfill material onto a wafer front side and encapsulates the flip chip package without the need for capillarity flow and flux dispensing. Thus, voids from capillarity flow may be avoided and flux-dispensing process is eliminated to prevent potential reliability risks resulting from residual fluxes. In this study, we describe the investigation of a new WLUF technology for fine pitch WLCSP packages and present the lamination and bonding test results using the WLUF materials on our test WLCSP packages.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
