Abstract
WO3 was evaluated as a candidate thermal barrier oxide material for protection of thermally sensitive systems (e.g., electronics packages) exposed to thermal cycling between −51 and 71 °C. A key factor for thermal barrier oxides is low thermal conductivity. Thermal conductivity serves as a quantifiable metric for assessing the thermal shielding/insulation behavior of a material. This paper assesses structural and phase effects on the thermal properties of WO3. Results suggest that the thermal conduction behavior of WO3 powders is driven by crystal/grain packing and in the temperature range of interest.
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