Abstract
Conical metallic nanostructures, due to their geometrical and physical properties, are advantageous compared to cylindrical nanowires in applications like electron field emission cathodes. In this paper a new method for fabrication and integration of vertically aligned metallic nanocones with random distribution is reported. The nanocones are deposited electrochemically at temperatures about 60°C and lower. An area of ca. 1cm2 is covered with nanocones. The density of nanocones ranges between 6×104 and 2×106cm−2, which gives a pitch range of 23 to 7μm. With this process the growth and integration of nanocones made of different materials like e.g. Au, Ni and Cu are enabled. The tip diameter of the cones can be modified between 50 and 700nm and the base diameter between 2.5 and 7μm, i.e. apex angles between 5.9° and 16.6° can be obtained. The surface roughness of the nanocone arrays is ±0.2μm.
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