Abstract
This paper describes two examples of nano-packaging technology using surface activated bonding (SAB): vertical contact of CNTs via to metal substrate, and heterogeneous bonding such as Si-Si3N4 and Si-Al2O3 wafers. In the both cases, controlled layer in nanometer-scale of the interface is essential in achieving the desired characteristics of the bonded interface..
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Schedule a callMore From: 2011 11th IEEE International Conference on Nanotechnology
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