Abstract

This paper explores silicon CMOS on-chip spiral inductors performance degradation under high RF power. A novel methodology to calibrate and characterize on-chip spiral inductor with large signal inputs (high/medium power) is presented. Experiments showed 12% degradation of quality factor in a particular inductor design when 34dBm RF power was applied. The degradation of quality factor of inductor can be attributed to a local self heating effect. Thermal imaging of such an inductor under high RF power validates the hypothesis.

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