Abstract
a novel oblique pyramid equivalent heat dissipation model is proposed for theoretically analyzing heat dissipation capacity of power chips with embedded TTSVs. Extra carefully researching correction of oblique thermal resistance, additional lateral thermal resistance, and thermal resistance of TSV insulation sleeve, the accurate theoretical thermal resistance model was established. Setting the FEA simulating results based on COMSOL Multiphysics as benchmark, heat dissipation effects of variation of radius of TTSV (r), thickness of the power chip (H0), and side length of the single cell (L0) have been numerically investigated. The maximum temperature relative error of the proposed model with FEA simulated results is not more than 0.2 %, 1 %, and 0.5 % for variation of r, H0, and L0, respectively. The proposed model has been theoretically and numerically proven to be effective and accurate.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
