Abstract

Space electronics play a pivotal role in enabling modern space missions, facilitating communication, navigation, remote sensing, and scientific exploration. However, the extreme conditions of space, including temperature variations, radiation exposure, and mechanical stresses, pose significant challenges for the materials used in electronic components. This conceptual review explores the next-generation materials for space electronics, aiming to address these challenges and push the boundaries of performance and reliability. The review begins by outlining the fundamental requirements for space electronics materials, emphasizing the need for extreme temperature resistance, radiation shielding, mechanical strength, and thermal conductivity. It then surveys the current state-of-the-art materials, including silicon-based materials, compound semiconductors, polymers, ceramics, and composites, highlighting their strengths and limitations in space applications. Furthermore, the review discusses emerging materials and technologies, such as 2D materials, organic electronics, quantum materials, and metamaterials, which hold promise for revolutionizing space electronics. Implementation strategies are proposed, considering factors like integration with existing systems, scalability, cost-effectiveness, environmental impact, and regulatory compliance. Through this conceptual review, insights are provided into the potential applications of next-generation materials in satellites, space probes, exploration missions, and beyond. The conclusion summarizes key findings, underscores potential implications for the future of space electronics, and offers recommendations for further research and development. By advancing the state of materials science for space electronics, this review aims to contribute to the ongoing exploration and utilization of space for the benefit of humanity.

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